Rigid PCB
Supplier Part Number Features Dk Df Tg
Shegyi S1141 Normal TG 4.6(1Mhz) 0.015(1Mhz) 140C
S1000 Middle TG 4.7(1Mhz) 0.011(1Mhz) 150C
S1000-2 Hight TG 4.6(1Ghz) 0.018(1Ghz) 180C
SH260 Hight TG,Polymide 4.12(1Ghz) 0.007(1Ghz) 250
ITEQ IT158 Middle TG 5.4 0.035 150C
IT-180 Hight TG 4.8(1Mhz) 0.016(1Mhz) 180C
TUC TU-768 Hight TG 4.3(1Ghz) 0.019(1Ghz) 170C
KB KB6160 Normal TG 4.58(1Mhz) 0.022(1Mhz) 135C
KB6165 Middle TG 4.65(1Mhz) 0.018(1Mhz) 153C
KB6168 Hight TG 4.4(1Mhz) 0.018(1Mhz) 180C
Elite EM370 Hight TG,halegon Free 4.4(1Ghz) 0.015(1Ghz) 175C
EM827 Hight TG 4.2(1Ghz) 0.019(1Ghz) 175C
Ventec VT-901 Hight TG,Polymide 4.05(1Gzh) 0.013(1Ghz) 250
Rogers RO4350B Non-PTFE 3.48(10Ghz) 0.0037(10Ghz) 280
RO4003C Hight TG 3.38(10Ghz) 0.0027(10Ghz) 280
RT5880 PTFE 2.2 0.0009 280
RT5870 Hight TG 2.33 0.0012 280
RT6202 Hight TG 2.94 280
RT6006 Hight TG 6.15 0.0019 280
RT6002 Hight TG 2.94 0.0012 280
RT6010 Hight TG 10.2 0.0023 280
ULTRA 2000 Hight TG 2.55 0.0019 280
Ro3010 Hight TG 10.2 0.0023 280
Ro3006 Hight TG 6.15 0.002 280
RO4725 Hight TG 2.55 280
Isola 185HR Hight TG 4.01 0.02 180
FR406 Hight TG 3.93 0.0167 170
FR408 Hight TG 3.67 0.012 180
370HR Hight TG 4.04 0.021 180
FR408HR Hight TG 3.68 0.0092 190
IS410 Hight TG 3.97 0.02 180
IS680 Hight TG 2.80-3.45 0.0025-0.0035 200
I-Speed Hight TG 3.64 0.006 180
MCPCB
Supplier Type Conductivity Thermal Impedance Dielectric Breakdown TG Note
Totking T110 1.5 W/m.k ℃ / W 0.65℃ / W 6KV 100℃ AL BASE
T111 2 W/m.k 0.55℃ / W 6KV 100℃ AL BASE
T112 3 W/m.k 0.45℃ / W 6KV 100℃ AL BASE
T112B 4 W/m.k 0.35℃ / W 6KV 130℃ AL BASE
T112C 5 W/m.k 0.25℃ / W 6KV 155℃ AL BASE
T113 2 W/m.k 0.55℃ / W 6KV 170℃ AL BASE
S111 2 W/m.k 0.55℃ / W 6KV 130℃ AL BASE
S112 3 W/m.k 0.45℃ / W 6KV 130℃ AL BASE
S113 2 W/m.k 0.55℃ / W 6KV 170℃ AL BASE
T511 3 W/m.k 0.35℃ / W 6KV 100℃ Copper BASE
T512 4 W/m.k 0.25℃ / W 6KV 100℃ Copper BASE
T513 3 W/m.k 0.35℃ / W 6KV 170℃ Copper BASE
S511 3 W/m.k 0.35℃ / W 6KV 130℃ Copper BASE
S512 4 W/m.k 0.25℃ / W 6KV 130℃ Copper BASE
S513 3 W/m.k 0.35℃ / W 6KV 170℃ Copper BASE
Polytronics TCB2(100um) 2W/m.k 0.13℃ / W 5KV 130℃ AL BASE
TCB4(100um) 4W/m.k 0.11℃ / W 4.5KV 140℃ AL BASE
TCB8(100um) 8W/m.k <0.08℃ / W 4.5KV 140℃ AL BASE
BoYu AL-01-P ( 70UM ) 0.8W/m.k 0.78℃ / W 3KV 158℃ AL BASE
AL-01-A ( 100UM ) 1W/m.k 0.64℃ / W 4KV 130℃ AL BASE
AL-01-B ( 100UM ) 2W/m.k 0.45℃ / W 4KV 130℃ AL BASE
AL-01-L ( 100UM ) 3W/m.k 0.2℃ / W 4KV 130℃ AL BASE
CU-01-P ( 70UM ) 0.8W/m.k 0.78℃ / W 3KV 158℃ Copper BASE
CU-01-B ( 100UM ) 2W/m.k 0.45℃ / W 4KV 130℃ Copper BASE
AL-02 ( 100UM ) 0.8-3W/m.k 0.78-0.28℃ / W 3KV 130-158℃ AL BASE
Berguist MP-06503(75um) 1.3W/m.k 0.58℃ / W 8.5KV 90℃ AL BASE
HT-04503(75um) 2.2W/m.k 0.32℃ / W 8.5KV 150℃ AL BASE
HT-07006(150um) 2.2W/m.k 0.71℃ / W 11KV 150℃ AL BASE
HPL-03015(38um) 3W/m.k 0.13℃ / W 5KV 185℃ AL BASE
Larid SS 1KA04(100um) 3W/m.k 0.34℃ / W 1.8KV 105℃ AL BASE
SS 1KA06(152um) 3W/m.k 0.52℃ / W 2.5KV 105℃ AL BASE
SS 1KA08(203um) 3W/m.k 0.7℃ / W 3.5KV 105℃ AL BASE
ML 1KA06(152um) 3W/m.k 0.35℃ / W 1.2KV 105℃ AL BASE
ML 1KA08(203um) 3W/m.k 0.552℃ / W 2.5KV 105℃ AL BASE
Vtech VT-4A1 1.6W/m.k 0.123 5KV 170℃ AL BASE
VT-4A2 2.2W/m.k 0.089 4.5KV 130℃ AL BASE
VT-4B3 4.2W/m.k 0.038 3KV 120℃ AL BASE

Name Type DK Thermal conductivty Material description Material field
Laird 1KA 4.1 2.2-3

high thermal conductivity ,good filling ability, pressing parameter adjustment is convenient

Material mature, mainly used in products which demand higher thermal conductive, more suitable for LED

Ventec VT-4A1 4.8 1.5

high thermal conductivity ,good filling ability

Suitable for power supply

Arlon 91ML 5.5 1-1.9

high TG, high heat resistance

Material is more expensive, use in harsh environment, military, LED or power supply

Arlon 49N 4.0 0.25

Poor thermal ability, but used in frequency domain

Used for high frequency board agglutinate

DuPont LG1000 3.5 0.35

A thermoplastic material, pressing parameter is wide

General use material, multi-purpose in military products

Rogers RO4350B/F 2.5 0.62

Poor thermal ability, but used in frequency domain

Used for high frequency board agglutinate

Emerson&Cuming CF3350 0 3.5-7.0

Thermal conductivity, electrical conductivity

Requirements grounding

FLEX AND RIGID-FLEX
Flex Materials
Supplier Type Copper PI
PI Shengyi SF302 0.33OZ,0.5OZ,1OZ 0.5MIL, 1MIL,2MIL
Dupont AP 0.5OZ,1OZ 1MIL,2MIL,3MIL
Panosonic RF-775,ED CU 0.33OZ,0.5OZ,1OZ 1MIL,2MIL
Panosonic RF-775,AD CU 0.33OZ,0.5OZ,1OZ 1MIL,2MIL
Coverlay shengyi SF302C 0515;1025;2030
Taiflex 1025;
Adhensive Taiflex 10um,25um,40um
Shengyi SF302B 25um,40um
PI stiffener Taiflex MHK 3mil, 5mil
3M 3M

PN CU(OZ) PI(mil) FOIL
AP9111R 1 1 RA
AP8525R 0.5 2 RA
AP9121R 1 2 RA
AP9222R 2 2 RA
AP9131R 1 3 RA
R-F775 11RB-M 1 1 RA
R-F775 12RB-M 0.5 1 RA
R-F775 21RB-M 1 2 RA
R-F775 22RB-M 0.5 2 RA
SF305 0.5/1/2 0.5/1/2 RA
SF305C N/A 0.5/1/2 N/A