CAD
KEY Parameters
  • Highest layer count:28
  • Maximum connections:30000
  • Minimum line width:3mil
  • Maximum BGAs in one board:44
  • Highest signal speed :12.8differential signal
  • Maximum pin count:40000
  • Minimum via hole size:4mil (3mil laser drill)
  • Minimum line to line space:3mil
  • Minimum BGA pin-pitch:0.4mm
  • Maximum BGA pin counts:1932
PCB

Listed below is a detailed list of our capabilities and design guidelines. Keeping your designs within our standard and advanced capabilities will yield the most competitive pricing. Our emerging technology capabilities support the most advanced PCB designs and we recommend having a DFM completed by Streamline Circuit’s Pre-Engineering team.

PCB Technology Roadmap
Rigid PCB
Feature Capacity
Raw Materials KB,ITEQ, SHENGYI,TUC,Megtron, Isola,Rogers, Neclo, Arlon
Layer 0 to 40L
PCB type HDI, Backplane, back drilling, Copper coin, Blind&buried
Min. Trace/spaces 3/3mil inner layer and 3/3mil outer layer
Min. Mechanical Drilling hole size 4mil
Max. Board size 22x59inch
Aspect Ratio 14:1
Max. Outer layer Copper 14oz
Max. Inner layer Copper 10oz
Min. Solder mask Dam 3mil
Min. Pad to Pad spaces 7mil
Min. Outline tolerance +/-4mil
Impedance control +/-10%
Min. BGA size 10mil(8mil for Soft Gold)
Countersink holes Special tools:82°、90°、120°、135°(countersink drilling size 12-393.7mil)
Press-fit holes tolerance +/-2mil
Flex PCB
Feature Capacity
Raw materials SHENGYI, Panasonic, DuPont, TAIFLEX, DOUSON, ITEQ,3M
Layer 1-8layers
Thickness 0.1-0.8mm Without Stiffener
Min. Trace/spaces 2.5/2.5mil inner layer and 2.5/2.5mil outer layer
Tolerance: +/-0.03mm for 1L;+/-0.05mm for >1L&Thk<0.3mm+/-0.1mm for >1L&Thk0.3-0.8mm
Max. Board size 220mm*575mm
Min. Coverlay Bridge 8mil
Min. Bend radius 3-6times of board thickness for single layer
6-10times of board thickness for double layer
10-15times of board thickness for multi- layer
Min. dynamic radius 20-40times of board thickness
Min. Mechanical Drilling 6mil
Max. finished copper thickness 5oz outer layer;3oz inner layer
Min. Spaces From Via to Conductor 6mil <4L;8mil 4-6L;12mil 7-8L
Impedance control +/-10%
Routing Tolerance +/-0.05mm for laser;+/-0.15mm for punching
Surface finish HASL, ENIG, ENEPIG , Hard Gold, Silver, Tin, OSP
Flex-Rigid PCB
Feature Capacity
Raw materials SHENGYI, Panasonic, DuPont, TAIFLEX, DOUSON, ITEQ,3M
Layer 2-20L
Board Thickness 0.2-4mm
Min. Trace/spaces 3/3mil inner layer and 3/3mil outer layer +/-0.1mm for Board thickness 0.3-0.8mm <=1mm
Tolerance: +/-10% for Board thickness >1mm
Max. Board size 400mm*550mm
Blind Via size 4-6mil
Aspect Ratio (laser drill) 0.8:1
Min. Spaces Blind via to Conductor 6mil for 1 step HDI
Plug with non-conductive Resin YES
Max. Buried Via 16mil
Min. BGA size 10mil(8mil for soft Gold)
Max. finished copper thickness 5oz outer layer;3oz inner layer
Min. Spaces From Via to Conductor 6mil <4L;8mil 4-6L;12mil 7-8L
Impedance control +/-10%
Min. Routing Tolerance +/-0.05mm
Surface finish HASL, ENIG, ENEPIG , Hard Gold, Silver, Tin, OSP
MCPCB
Feature Capacity
Raw materials Totking;Ventec;Laird;Bergquist;Elite;POLYTRONICS;NRK, Shengyi,Begete,BOYU;3M Tape;
Layer 1-8L
Board Thickness 0.25-5mm
Min. finish hole size NPTH:20+/-2mil, PTH:40+/-4mil
Max. Board size 1200mm*600mm
Metal Materials AL: 1100/1052/5052/6061;CU:c1100;IRON Thickness:0.5 0.8 1.0 1.2 1.5 2.0 3.0 3.2 (mm)
Thermal conductivity 0.3-33w/mk
Copper thickness 0.5oz-3oz
Mirror AL Core PCB Reflective:95%&98% Thickness :0.7&1mm
Solder mask reflective Paint 85% up to Special White
Special Hole Blind Hole. Blind Slot. T-Hole. T-Slot. Counter Sink Hole. Cup Hole
Ceramic substrate PCB 24-180w/mk Ceramic DBC(ALN&Al2O3) Max size 4”x 4”, Min. size:0.2” x 0.2”
ITEM Standard Advanced Energin
Layer Count 2 to 36 48+ 60+
FR4 Tg 140 Yes Yes Yes
FR4 Tg 170 Yes Yes Yes
Super High Tg 210 Yes Yes Yes
High speed Yes Yes Yes
High frequency Yes Yes Yes
Halogen Free Yes Yes Yes
Finished Thickness [Multilayer] .005″ to .220″ .220″-.250″ Greater than .250″
Finished Thickness Tolerance [+/-] 10% 7% 5%
Multiple Laminations 2 4 5+
Copper Foil Weights Internal 1/4 to 2 Up to 6 ounce Up to 6 ounce
Copper Foil Weights External 1/4 to 3 Up to 4 ounce Greater than 6 ounce
Lines, Spaces, & Pad Diameters
ITEM Standard Advanced Energin
Internal Line Width .004″ .002.5” Less than .002.5″
Internal Spacing .004″ .002.5” Less than .002.5″
External Line Width .004″ .002.5” Less than .002.5″
External Spacing .004″ .002.5” Less than .002.5″
Int. Pad Size-A/R Per Side (Fin.-.001) .005″ .004″ Less than .004″
Ext. Pad Size-A/R Per Side (Fin.-.002) .003″ .003″ Less than .003″
SMT Pitch .012″ .012″ Less than .012″
Impedance 10% 5% Greater than 5%
Electroplating
ITEM Standard Advanced Energin
Tin Lead Plating Thickness .0003″-.0005″ Greater than .0005″ Greater than .0005″
Tin Nickel Plating Thickness 150Microinches 250 Micro inches Greater than 250 Microinches
Low Stress Nickel 100 Micro inches 250 Micro inches Greater than 250 Microinches
Gold Plating Thickness 30 Micro inches As Specified As Specified
Minimum Drilled Hole Size 0.012 .0098″ Less than .0059″
Hole Aspect Ratio 10 to 1 15 to 1 Less than 20 to 1
Conductor Finishes
ITEM Standard Advanced Energin
HASL Yes Yes Yes
White Tin Yes Yes Yes
Carbon Ink Yes Yes Yes
Lead Free Finishes
ITEM Standard Advanced Energin
Electroless Nickel/Paladium/Gold Yes Yes Yes
Electroless Nickel/Immersion Gold Yes Yes Yes
Immersion Silver Yes Yes Yes
Lead free hasl Yes Yes Yes
Tolerances
ITEM Standard Advanced Energin
Drilled Hole To Copper .008″ .007″ .006″
Non Plated Hole Tolerances [+/-] .002″ .001″ Less than .001″
Via Capabilities
ITEM Standard Advanced Energin
Laser Micro Vias .006″ .004″ Less than .002″
Blind/Buried Vias .008″ .004″ Less than .002″
Via Under PAD Yes Yes Yes
Back Drill Yes Yes .008″ larger than Primary Drill
Back drill Antipad Yes Yes .020″ larger than Primary Drill
Laser Drill .004 .002 Less than .002
Mechanical Vias .006 .004 Less than .004
Tented LPI Coated With LPI Coated/plugged Coated/plugged
Plugged UV Curable [no solvent] Maximum .020″ Yes Yes
Silver Conductive Via Fill Yes Yes Yes
Non-Conductive ViaFill Yes Yes Yes
Soldermask and Legend
ITEM Standard Advanced Energin
Minimum Mask Clearance [LPI] .004″ .002″ Less than .002″
Minimum Soldermask Thickness 0.0004″ 0.0004″ 0.0004″
Soldermask Type LPI LPI As required
Soldermask Color Green Any Color Any Color
Soldermask Web Minimum .004″ .004″ Less than .003″
Legend Color White Any Color Any Color
Standard IPC Standard II IPC standard III Review Required
SMT
Highest layer count:28 Maximum pin count:40000
Maximum connections:30000 Minimum via hole size:4mil (3mil laser drill)
Minimum line width:3mil Minimum line to line space:3mil
Maximum BGAs in one board:44 Minimum BGA pin-pitch:0.4mm
Highest signal speed :12.8differential signal Maximum BGA pin counts:1932