We can do, Blind & Buried via, Back drill, via resin filling, heavy copper, heat-sink, metal base, embedded passive component ,FPC, Rigid flex, embedded passive component, Blind slot, side-plating, pattern/selective thick gold plating, step laminating, coplanar circuit, Hybrid lamination. Thermoelectric Separation Copper Based PCB. Silver Filled Hole, Copper Filled Hole, Bending Al PCB. Power flex and RF/Microwave Boards.

Rigid Print circuit boards

Layer count:4 layers

Surface treatment:ENEPIG

Layer count:10 layers

Thickness:1mm

Size:13.15mm*42.91mm

Surface treatment:flash gold+Hard gold

Layer count:10layer

Thickess:2.8mm

Surface treatment:flash gold+hard gold

Probe card

Layer count:4 layers

Surface treatment:ENEPIG

Layer count:10 layers

Thickness:1mm

Size:13.15mm*42.91mm

Surface treatment:flash gold+Hard gold

MCPCB

Layer count:Double Layers

Copper thickness:5/5oz copper +Al base

Surface treatment: HASL with Lead Free

Type:single size Al-substrate PCB

Layer Counts:1L

Thermal conductivity:1.5 W/M.K

Electric Strength :2000VAC

Application:relay

Treatment:HASL

Type:Metal-Buried PCBL

Layer Counts:4LL

Thermal conductivity:0.35-3 W/M.KL

Application:Signal stationL

Surface Treatment:ENIGL

Type:Al-Core Multilayer

Layer Counts:2L+AL+2L

Thermal conductivity:0.35-3 W/M.K

Application:LED Display

Surface Treatment:Gold Plating

Rigid-flex

Layer count :8layers(flex 2 layer)

Thickness :1.6mm

Min vias :0.25mm

Size :132*164mm

stiffeners:AL

Layer count :18layers (8 layer flex )

thickness:3.3mm

Min vias:0.2mm

Size :190*177mm

HDI&rigid-flex& CU substrate

Flex

2 layer flex

Good fingers+ FR4 Stiffeners

Connectors

2 layer flex

Good fingers+ PI Stiffeners

Connectors

SMT

Medical filed

Requirement: High Reliability& High level quality

Industry:Pin-pitch:0.4mm BGA

High requirement of Re-flow time and exact temperature.

Sn ball qty: 1849 Avoid rework

CAD
Only you provide the schematic, we can help you do CAD Design, we use 4 SoftwareAllegro、AD、PADS、Mentor.